Manuscript received March 9, 2023; revised April 14, 2023; accepted May 23, 2023.
Abstract—This research aimed to develop an M-MIAP
learning model via Metaverse to develop the engineering
competencies of pre-engineering students, and to evaluate the
appropriateness of the model. This research is divided into two
phases. In the first phase, literature studies of various learning
models were conducted to construct the matrix of Metaverse
elements and engineering competency for the M-MIAP model.
The second phase was the evaluation of the appropriateness of
the developed M-MIAP model by various expert stakeholders in
the fields of information technology, communication technology,
Metaverse, and pre-engineering. It was found that the M-MIAP
model consists of input, M-MIAP learning process, engineering
competency, and feedback. This research uses Metaverse in the
learning process to provide students with a new virtual
dimension experience. This collaborative learning process also
results in a deeper comprehension of the subject matter and
increases educational opportunities for students. The assessment
result was rated as “very good”, suggesting the suitability of the
overall learning model. This indicates that the M-MIAP model
can be utilized to cultivate engineering competencies in
pre-engineering students, and to prepare for the impending
transition to the digital era. It also supports the educational
system in achieving the same level of enduring quality.
Index Terms—MIAP learning, Metaverse, engineering
competency
Junjiraporn Thongprasit and Pallop Piriyasurawong are with Department
of Technological Education and Information, Faculty of Technical
Education, King Mongkut’s University of Technology North Bangkok,
Bangkok, Thailand.
*Correspondence: junjiraporn.t@op.kmutnb.ac.th (J.T.)
Cite: Junjiraporn Thongprasit* and Pallop Piriyasurawong, "An M-MIAP Learning Model to Develop Engineering Competency of Pre-Engineering Students via Metaverse," International Journal of Information and Education Technology vol. 13, no. 9, pp. 1430-1438, 2023.
Copyright © 2023 by the authors. This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).